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SiA777EDJ
Vishay Siliconix
N- and P-Channel for Level Shift Load Switch
PRODUCT SUMMARY
V DS (V) R DS(on) ( Ω )
0.225 at V GS = 4.5 V
I D (A)
1.5 a
Q g (Typ.)
FEATURES
? Halo g en-free Accordin g to IEC 61249-2-21
Definition
? TrenchFET ? Power MOSFETs
N-Channel
P-Channel
20
- 12
0.270 at V GS = 2.5 V
0.345 at V GS = 1.8 V
0.960 at V GS = 1.5 V
0.057 at V GS = - 4.5 V
0.077 at V GS = - 2.5 V
0.115 at V GS = - 1.8 V
0.200 at V GS = - 1.5 V
1.5 a
1.5 a
0.5
- 4.5 a
- 4.5 a
- 4.5 a
- 1.5
1.1 nC
5 nC
? Typical ESD Protection: N-Channel 2800 V
P-Channel 1900 V
? 100 % R g Tested
? Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
? Load Switch with Level Shift for Portable Devices
- N-Channel for Level Shift Drive
- P-Channel for Main Switch
PowerPAK ? SC-70-6 Dual
1
S 1
2
G 1
S 2
Q 2
D 2
D 1 /G 2
D 1 /G 2
D
1/G
2
6
N C
5
2.05 mm
4
S 2
D 2
3
D 2
2.05 mm
Marking Code
EFX
Part # code
XXX
Lot Tracea b ility
and Date code
G 1
R
Q 1
Ordering Information: SiA777EDJ-T1-GE3 (Lead (P b )-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
S 1
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
V DS
V GS
N-Channel
20
±6
P-Channel
- 12
±8
Unit
V
T C = 25 °C
1.5
a
- 4.5
a
Continuous Drain Current (T J = 150 °C)
Pulsed Drain Current
Source Drain Current Diode Current
T C = 70 °C
T A = 25 °C
T A = 70 °C
T C = 25 °C
T A = 25 °C
T C = 25 °C
I D
I DM
I S
1.5 a
1.5 a, b, c
1.5 a, b, c
4
1.5 a
1.6 b, c
5
- 4.5 a
- 4.5 a, b, c
- 3.9 b, c
- 15
- 4.5 a
- 1.6 b, c
7.8
A
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
3.2
1.9 b, c
5
1.9 b, c
W
T A = 70 °C
1.2 b, c
1.2 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
N-Channel
P-Channel
Parameter
Maximum Junction-to-Ambient b, f t ≤ 5s
Maximum Junction-to-Case (Drain) Steady State
Symbol
R thJA
R thJC
Typ. Max.
52 65
20 25
Typ. Max.
52 65
12.5 16
Unit
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile ( www.vishay.com/ppg?73257 ). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions for channel 1 and channel 2 is 110 °C/W.
Document Number: 65371
S09-2032-Rev. A, 05-Oct-09
www.vishay.com
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